This website includes an animation of finished wafer to packaged integrated Circuits. Objective: Describe the wafer to packaged device process steps. This simulation is from Module 075 of the Process & Equipment III Cluster of the MATEC Module Library (MML). You will find the animation under the heading "Process & Equipment III." To view other clusters or for more information about the MML visit http://matec.org/ps/library3/process_I.shtmlKey
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